公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2018 | Novel RDL design of wafer-level packaging for signal/power integrity in LPDDR4 application | K.-B. Wu; T.-Y. Kuo; B. Hung; B. Lin; C. Peng; M.-T. Yang; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 10 | 6 | |
2011 | Optimal decoupling capacitors design for suppressing edge radiation of power/ground planes | K.-W. Li; K.-B. Wu; R.-B. Wu; RUEY-BEEI WU | IEEE 20th Topical Meeting on Electrical Performance of Electronic Packaging | 3 | 0 |