Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
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2020 | Improvement of Sn-3Ag-0.5Cu Soldered Joints Between Bi 0.5 Sb 1.5 Te 3 Thermoelectric Material and a Cu Electrode | Chuang, T.-H.; Hsu, S.-W.; Lin, Y.-C.; Yeh, W.-T.; Chen, C.-H.; Lee, P.-I.; Wu, P.-C.; Cheng, H.-P.; TUNG-HAN CHUANG | Journal of Electronic Materials | 5 |