公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2018 | Non-periodic flipped-SIR EBG for dual-band SSN mitigation in 2-layer PCB | Y.-C. Wang; H.-W. Chan; H.-C. Hsieh; Y.-H. Lin; W.-S. Wang; S.-H. Wang; R.-B. Wu; RUEY-BEEI WU | 2018 IEEE Electrical Design of Advanced Packaging and Systems | 1 | 0 | |
2006 | Novel compact net-type resonators and their applications to microstrip bandpass filters | C.-F. Chen; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Microwave Theory and Techniques | 49 | 43 | |
2018 | A novel dual sided fly-by topology for 1 to 8 DDR with optimized signal integrity by EBG design | C.-C. Chiu; K.-Y. Yang; Y.-H. Lin; W.-S. Wang; T.-Y. Wu; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 7 | 6 | |
2018 | Novel RDL design of wafer-level packaging for signal/power integrity in LPDDR4 application | K.-B. Wu; T.-Y. Kuo; B. Hung; B. Lin; C. Peng; M.-T. Yang; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 10 | 6 | |
2011 | Optimal decoupling capacitors design for suppressing edge radiation of power/ground planes | K.-W. Li; K.-B. Wu; R.-B. Wu; RUEY-BEEI WU | IEEE 20th Topical Meeting on Electrical Performance of Electronic Packaging | 3 | 0 | |
2010 | Optimization of FIR filter to improve eye diagram for general transmission line systems | Y.-S. Cheng; Y.-C. Lai; R.-B. Wu; RUEY-BEEI WU | Design, Automation, and Test in Europe Conference | 6 | 0 | |
2011 | Passive equalizer design for through silicon vias with perfect compensation | R.-B. Sun; C.-Y. Wen; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 20 | 16 | |
2011 | Passive FIR filter design using reflections from stubs for high speed links | Y.-S. Cheng; R.-B. Wu; RUEY-BEEI WU | 2011 Electrical Design of Advanced Packaging and Systems | 0 | 0 | |
2008 | Placement of shorting vias for power integrity in multi-layered structures | S.-H. Hsu; Y.-S. Cheng; W.-D. Guo; H.-H. Cheng; C.-C. Wang; R.-B. Wu; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | 0 | 0 | |
2016 | Promoting effective education in electromagnetics - Taiwan’s school of accessible and visualized electromagnetics (SAVE) formed | W.-J. Liao; R.-B. Wu; T.-L. Wu; T.-G. Ma; Y.-H. Pang; Z.-M. Tsai; H.-H. Yu; K.-M. Tu; H.-C. Lin; S. T. Peng; RUEY-BEEI WU | IEEE Antennas and Propagation Magazine | 5 | 4 | |
2016 | Promoting Effective Education in Electromagnetics - Taiwan��s School of Accessible and Visualized Electromagnetics Formed | W.-J. Liao; R.-B. Wu; T.-L. Wu; T.-G. Ma; Y.-H. Pang; Z.-M. Tsai; H.-H. Yu; K.-M. Tu; H.-C. Lin; S.-T. Peng; TZONG-LIN WU | IEEE Antennas and Propagation Magazine | | | |
2005 | Prototype of planar Ka-band switched beamforming network | A.-S. Liu; H.-S. Wu; C.-K. C. Tzuang; R.-B. Wu; RUEY-BEEI WU | International Joint Conference of the 7th Topical Symposium on Millimeter Waves(TSMMW2005) | | | |
2010 | RC passive equalizer for through silicon via | R.-B. Sun; C.-Y. Wen; R.-B. Wu; RUEY-BEEI WU | 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 | 4 | 0 | |
2014 | Recent progress of advanced microwave and system-in-package integration technologies at National Taiwan University | H. Wang; T.-L. Wu; P. Hsu; R.-B. Wu; K.-Y. Lin; T.-W. Huang; TZONG-LIN WU | Asia-Pacific Microw. Conference (APMC) | 0 | | |
2008 | Reflection enhanced compensation of lossy traces for best eye-diagram improvement using high-impedance mismatch | W.-D. Guo; F.-N. Tsai; G.-H. Shiue; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Advanced Packaging | 23 | 19 | |
2015 | Ringing noise suppression for differential signaling in unshielded flexible flat cable | S.-Y. Huang; T.-Y. Huang; C.-T. Liu; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 2 | 3 | |
2011 | SI-aware layout and equalizer design to enhance performance of high-speed links in blade servers | Y.-S. Cheng; H.-H. Lu; M. Chang; S. Chang; B. Liu; R.-B. Wu; RUEY-BEEI WU | IEEE 20th Topical Meeting on Electrical Performance of Electronic Packaging | 5 | 0 | |
2013 | SI-aware vias and contact pads layouts and L-R equalization technique for 12Gb/s backplane serial I/O interconnections | Y.-S. Cheng; B. Liu; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Electromagnetic Compatibility | 5 | 3 | |
2008 | Signal integrity analysis of DDR3 high-speed memory module | C.-K. Chen; W.-D. Guo; C.-H. Yu; R.-B. Wu; RUEY-BEEI WU | 2008 Electrical Design of Advanced Packaging and Systems Symposium | 12 | 0 | |
2006 | Steady-state response by finite-difference time-domain method and Lanczos algorithm | T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Microwave Theory and Techniques | 3 | 2 | |