Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
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2022 | Rapid thermal process driven intra-die device variations | Tsai, CH; Aboy, M; Pelaz, L; Hsu, YH; Woon, WY; Timans, PJ; CHIH-KUNG LEE | MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING | 0 | 0 |