公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2012 | The critical oxide thickness for Pb-free reflow soldering on Cu substrate | Chung, C.Key; Chen, Y.J.; Li, C.C.; C. ROBERT KAO | Thin Solid Films | 26 | 23 | |
2010 | DIRECT VERSUS ITERATIVE MODEL UPDATING METHODS FOR MASS AND STIFFNESS MATRICES | Yang, Y.B.; Chen, Y.J. | International Journal of Structural Stability and Dynamics | 16 | 13 | |
2011 | Experimental Evidence for Formation of Ni-Al Compound in Flip-Chip Joints Under Current Stressing | Tsai, M.Y.; Lin, Y.L.; Tsai, M.H.; Chen, Y.J.; C. ROBERT KAO | Journal of ELECTRONIC MATERIALS | 1 | 1 | |
2011 | Laminar pattern induced by cycling thermomechanical stress in two-phase materials | Chang, C.C.; Chen, Y.J.; Tsai, M.Y.; C. ROBERT KAO ; CHIEN-CHENG CHANG | Materials Chemistry and Physics | 0 | 0 | |