公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2010 | Electromigration in flip chip solder joints under extra high current density | Lin, Y.W.; Ke, J.H.; Chuang, H.Y.; Lai, Y.S.; C. ROBERT KAO | Journal of Applied Physics | 23 | 23 | |
2012 | Elimination of voids in reactions between Ni and Sn: A novel effect of silver | Chuang, H.Y.; Yu, J.J.; Kuo, M.S.; Tong, H.M.; C. ROBERT KAO | Scripta Materialia | 79 | 76 | |
2012 | Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing | Ke, J.H.; Chuang, H.Y.; Shih, W.L.; C. ROBERT KAO | Acta Materialia | 67 | 67 | |
2010 | Novel Cu-RuNx composite layer with good solderability and very low consumption rate | Chuang, H.Y.; Lin, C.H.; Chu, J.P.; C. ROBERT KAO | Journal of Alloys and Compounds | | | |