https://scholars.lib.ntu.edu.tw/handle/123456789/76045
標題: | Novel Cu-RuNx composite layer with good solderability and very low consumption rate | 作者: | Chuang, H.Y. Lin, C.H. Chu, J.P. C. ROBERT KAO |
公開日期: | 2010 | 卷: | 504 | 期: | 2 | 起(迄)頁: | - | 來源出版物: | Journal of Alloys and Compounds | URI: | https://www.scopus.com/record/display.uri?eid=2-s2.0-77955412522&origin=resultslist&sort=plf-f&src=s&sid=71011588b997c96b22b7221bdcbc0d09&sot=b&sdt=b&s=TITLE-ABS-KEY%28Novel+Cu-RuNx+composite+layer+with+good+solderability+and+very+low+consumption+rate%29&sl=98&sessionSearchId=71011588b997c96b22b7221bdcbc0d09&relpos=0 | DOI: | 10.1016/j.jallcom.2010.05.131 |
顯示於: | 材料科學與工程學系 |
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