公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2005 | A comparative molecular dynamics study of copper trench fill properties between Ta and Ti barrier layers | Yang, J.Y.; Hong, R.T.; Huang, M.J. | Materials Science in Semiconductor Processing | | | |
2005 | A comparative molecular dynamics study of copper trench fill properties between Ta and Ti barrier layers | Yang, J.Y.; Hong, R.T.; Huang, M.J.; MEI-JIAU HUANG | Materials Science in Semiconductor Processing | | | |
2005 | Molecular dynamics study of copper trench filling in damascene process | Hong, R.T.; Huang, M.J.; Yang, J.Y.; MEI-JIAU HUANG | Materials Science in Semiconductor Processing | | | |
2005 | Molecular dynamics study of copper trench filling in damascene process | Hong, R.T.; Huang, M.J.; Yang, J.Y. | Materials Science in Semiconductor Processing | | | |