公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2023 | An Embedded Common-Mode Filter and Mixed-Mode Scattering Parameters for the MIPI C-PHY Interface | Chien, Yung Chi; Liu, Hsu Wei; Chou, Chiu Chih; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | | | |
2023 | A Low-Loss Via-Free Ridge Air-Filled Substrate Integrated Waveguide on Printed Circuits Board for mmWave Application | Ting, Cheng Wu; Liu, Hsu Wei; Liao, Chung Hsing; Lee, Chien Cheng; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 0 | | |
2023 | A Novel Patterned Ground Structure With Shunt and Series Lumped Elements for Synthesizing Absorption Common-Mode Filters | Liu, Hsu Wei; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 1 | 1 | |
2022 | Reducing the Number of Measurements of a Multiport Circuit Using Covering Designs and Turán Systems | Chien, Yung Chi; Liu, Hsu Wei; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 0 | 1 | |
2022 | A Wideband Single-Cell Unidirectional Absorption Common-Mode Filter with Pattern Ground Structure | Liu, Hsu Wei; TZONG-LIN WU | 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2022 | 1 | 0 | |