https://scholars.lib.ntu.edu.tw/handle/123456789/636184
標題: | A Low-Loss Via-Free Ridge Air-Filled Substrate Integrated Waveguide on Printed Circuits Board for mmWave Application | 作者: | Ting, Cheng Wu Liu, Hsu Wei Liao, Chung Hsing Lee, Chien Cheng TZONG-LIN WU |
關鍵字: | Air-filled substrate integrated waveguide (AFSIW) | Copper | Dielectric losses | Electromagnetic waveguides | Metals | millimeter wave | Millimeter wave communication | printed circuit board (PCB) | Printed circuits | ridge waveguide | Substrates | via-free | 公開日期: | 1-一月-2023 | 來源出版物: | IEEE Transactions on Components, Packaging and Manufacturing Technology | 摘要: | A novel via-free ridge air-filled substrate integrated waveguide (VF-RAFSIW) structure is first proposed on printed circuits board in mmWave band. With copper paste and electroplating, the proposed VF-RAFSIW is entirely enclosed by copper; it can be built up with low-cost FR4 substrate in a typical PCB process. The ridge design makes the VF-RAFSIW more compact and more stable in electric performance when compared to the conventional RAFSIW. The cutoff frequency and propagation constant can be determined with the Ritz-Galerkin method. The back-to-back transition structures from microstrip to VF-RAFSIW are fabricated and measured for several lengths. By avoiding using the vias, the width of VF-RAFSIW is reduced by 46% compared to that of conventional AFSIW. The measured attenuation constant of VF-RAFSIW is 0.27 dB/cm at 60 GHz. The excellent performance of propagation loss reveals that the VF-RAFSIW is a good candidate for transmission structure in mmWave and sub-THz bands. Finally, a phase shifter designed in the VF-RAFSIW technology is demonstrated to show the feasibility of this platform. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/636184 | ISSN: | 21563950 | DOI: | 10.1109/TCPMT.2023.3312139 |
顯示於: | 電機工程學系 |
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