Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
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2016 | Full intermetallic joints for chip stacking by using thermal gradient bonding | Yang T.L.; Aoki T.; Matsumoto K.; Toriyama K.; Horibe A.; Mori H.; Orii Y.; Wu J.Y.; C. ROBERT KAO | Acta Materialia | |||
2020 | The impact of covid-19 on gastrointestinal motility testing in asia and europe | Mori H.; Schol J.; Geeraerts A.; Huang I.-H.; Jandee S.; Gonlachanvit S.; PING-HUEI TSENG ; Lu C.-L.; Kamiya T.; Kim N.; Lee Y.Y.; Kuribayashi S.; Tack J.; Suzuki H. | Journal of Clinical Medicine | 5 | 4 |