Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2006 | Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package | Chuang, Tung-Han ; Yen, Shiu-Fang | Journal of Electronic Materials | |||
2006 | Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish | Chuang, Tung-Han ; Yen, Shiu-Fang; Wu, Hui-Min | Journal of Electronic Materials | |||
2006 | Sn3Ag0.5Cu無鉛銲錫添加稀土元素Ce之球格陣列構裝界面反應與錫鬚成長研究 | 顏秀芳; Yen, Shiu-Fang |