公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2022 | The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology | Yen C; Chang S; Chen K; Feng Y; Chen L; Liao B; Lee M; Chen S; Liao M.; MING-HAN LIAO | IEEE Transactions on Electron Devices | |||
2021 | Nanogold induces anti-inflammation against oxidative stress induced in human neural stem cells exposed to amyloid-beta peptide | Chiang M.-C; Nicol C.J.B; Lin C.-H; Chen S.-J; Yen C; RONG-NAN HUANG ; SHIANG-JIUUN CHEN | Neurochemistry International | 18 | 15 | |
2021 | Performance Improvement by Double-Layer a-IGZO TFTs with a Top Barrier | Chiu J; Li S; Lee M; Yen C; Chen T; Chou C; CHEE-WEE LIU | IEEE Journal of the Electron Devices Society |