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2021
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全文
1
2022
Microstructure and mechanical properties of medium-entropy alloys with a high-density η-D024 phase
Shen P.-K; Liu H.-C; Huang C.-Y; Yen H.-W; Yeh J.-W; Tsai C.-W.; HUNG-WEI YEN
Materials Characterization
2
2022
Vacuum Brazing of Metallized YSZ and Crofer Alloy Using 72Ag-28Cu Filler Foil
Huang L.-W; Shiue R.-K; Liu C.-K; Cheng Y.-N; Lee R.-Y; Tsay L.-W.; REN-KAE SHIUE
Materials
3
2022
Effects of La addition on the microstructure and mechanical properties of CoCrNi medium entropy alloy
Chan S.-N; Hsueh C.-H.; CHUN-HWAY HSUEH
Journal of Alloys and Compounds
4
2022
Effects of yttrium addition on microstructures and mechanical properties of CoCrNi medium entropy alloy
Hong X; Hsueh C.-H.; CHUN-HWAY HSUEH
Intermetallics
5
2021
Effect of atomic layer plasma treatment on TALD-ZrO2 film to improve the corrosion protection of Mg-Ca alloy
Lin P.C; Lin K.F; Chiu C; Semenov V.I; Lin H.C; HSIN-CHIH LIN
; MIIN-JANG CHEN
Surface and Coatings Technology
5
5
6
2021
Effects of ball milling and additives (activated carbon and copper) on hydrogen absorption characteristics of ZK60 alloy
Abbas A; Hu K.-C; Lin H.-C; Lin K.-M.; HSIN-CHIH LIN
Materials Chemistry and Physics
7
2021
White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5
Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO
2021 International Conference on Electronics Packaging, ICEP 2021
8
2021
Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications
Zhu Z.X; Renganathan V; C. ROBERT KAO
Journal of Electronic Materials
9
2021
Dissimilar brazing of Ti–15Mo–5Zr–3Al and commercially pure titanium using Ti–Cu–Ni foil
Yue G.-L; Chen T.-C; Shiue R.-K; Tsay L.-W.; REN-KAE SHIUE
Materials
10
2021
A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn
Tsai C.-H; Lin S.-Y; Lee P.-T; C. ROBERT KAO
Intermetallics