https://scholars.lib.ntu.edu.tw/handle/123456789/342911
Title: | Thermal conduction analysis on microwave IC packages | Authors: | J.-F. Kiang S.-P. Liu W.-T. Lo JEAN-FU KIANG |
Issue Date: | Jun-1998 | Source: | URSI Radio Science Meeting | URI: | http://scholars.lib.ntu.edu.tw/handle/123456789/342911 |
Appears in Collections: | 電信工程學研究所 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.