https://scholars.lib.ntu.edu.tw/handle/123456789/370895
Title: | Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process | Authors: | Tang, C.-W. Li, K.-M. Young, H.-T. HONG-TSU YOUNG KUAN-MING LI |
Issue Date: | 2012 | Journal Volume: | 7 | Journal Issue: | 7 | Start page/Pages: | 693-696 | Source: | Micro and Nano Letters | URI: | http://www.scopus.com/inward/record.url?eid=2-s2.0-84879851168&partnerID=MN8TOARS http://scholars.lib.ntu.edu.tw/handle/123456789/370895 |
DOI: | 10.1049/mnl.2012.0303 |
Appears in Collections: | 機械工程學系 |
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