https://scholars.lib.ntu.edu.tw/handle/123456789/381343
Title: | SI-aware vias and contact pads layouts and L-R equalization technique for 12Gb/s backplane serial I/O interconnections | Authors: | Y.-S. Cheng B. Liu R.-B. Wu RUEY-BEEI WU |
Issue Date: | Dec-2013 | Journal Volume: | 55 | Journal Issue: | 6 | Start page/Pages: | 1284-1292 | Source: | IEEE Transactions on Electromagnetic Compatibility | URI: | http://scholars.lib.ntu.edu.tw/handle/123456789/381343 | DOI: | 10.1109/temc.2013.2266256 |
Appears in Collections: | 電機工程學系 |
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