https://scholars.lib.ntu.edu.tw/handle/123456789/425063
標題: | A compatible and crosslinked poly(2-allyl-6-methylphenol-co-2,6-dimethylphenol)/polystyrene blend for insulating adhesive film at high frequency | 作者: | Lin, Yan Cheng Chiang, Chi Haw Kuo, Chih Cheng Hsu, Sheng Ning Higashihara, Tomoya Ueda, Mitsuru WEN-CHANG CHEN |
關鍵字: | dielectric constant | high-frequency adhesive | poly(2-allyl-6-methylphenol-co-2,6-dimethylphenol) | polymer blend | polystyrene | 公開日期: | 15-八月-2019 | 出版社: | WILEY | 卷: | 136 | 期: | 31 | 來源出版物: | Journal of Applied Polymer Science | 摘要: | © 2019 Wiley Periodicals, Inc. A polymer blend consisting of poly(2-allyl-6-methylphenol-co-2,6-dimethylphenol) (APPE) and polystyrene (PS) with additives such as 1,2-bis(4-vinylphenyl)ethane, cyanate ester, and nitrile butadiene rubber was formulated as an insulating high-frequency adhesive film. The polymer blend of APPE and PS showed very high compatibility to these additives, and the resulting thermally cured polymer blend exhibited an excellent mechanical strength, as shown by an ultimate tensile strength of 51 MPa and Young's modulus of 1.4 GPa. Moreover, the blend exhibited very good dielectric properties, with a dielectric constant of 2.3 and a dissipation factor of 0.0030 at 10 GHz. The glass-transition temperature of the cured polymer blend was 141 °C, as determined by differential scanning calorimetry, and the 5% weight loss temperature was 372 °C, indicating relatively high thermal resistance characteristics. Furthermore, its peel strength to a copper foil reached 0.80 N/mm. The present study suggested that the thermally cured APPE/PS polymer blend with additives will have potential applications for the next-generation high-frequency adhesives in microelectronic circuits. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47828. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/425063 | ISSN: | 00218995 | DOI: | https://api.elsevier.com/content/abstract/scopus_id/85064183608 10.1002/app.47828 |
顯示於: | 化學工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。