https://scholars.lib.ntu.edu.tw/handle/123456789/425063
Title: | A compatible and crosslinked poly(2-allyl-6-methylphenol-co-2,6-dimethylphenol)/polystyrene blend for insulating adhesive film at high frequency | Authors: | Lin, Yan Cheng Chiang, Chi Haw Kuo, Chih Cheng Hsu, Sheng Ning Higashihara, Tomoya Ueda, Mitsuru WEN-CHANG CHEN |
Keywords: | dielectric constant | high-frequency adhesive | poly(2-allyl-6-methylphenol-co-2,6-dimethylphenol) | polymer blend | polystyrene | Issue Date: | 15-Aug-2019 | Publisher: | WILEY | Journal Volume: | 136 | Journal Issue: | 31 | Source: | Journal of Applied Polymer Science | Abstract: | © 2019 Wiley Periodicals, Inc. A polymer blend consisting of poly(2-allyl-6-methylphenol-co-2,6-dimethylphenol) (APPE) and polystyrene (PS) with additives such as 1,2-bis(4-vinylphenyl)ethane, cyanate ester, and nitrile butadiene rubber was formulated as an insulating high-frequency adhesive film. The polymer blend of APPE and PS showed very high compatibility to these additives, and the resulting thermally cured polymer blend exhibited an excellent mechanical strength, as shown by an ultimate tensile strength of 51 MPa and Young's modulus of 1.4 GPa. Moreover, the blend exhibited very good dielectric properties, with a dielectric constant of 2.3 and a dissipation factor of 0.0030 at 10 GHz. The glass-transition temperature of the cured polymer blend was 141 °C, as determined by differential scanning calorimetry, and the 5% weight loss temperature was 372 °C, indicating relatively high thermal resistance characteristics. Furthermore, its peel strength to a copper foil reached 0.80 N/mm. The present study suggested that the thermally cured APPE/PS polymer blend with additives will have potential applications for the next-generation high-frequency adhesives in microelectronic circuits. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47828. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/425063 | ISSN: | 00218995 | DOI: | https://api.elsevier.com/content/abstract/scopus_id/85064183608 10.1002/app.47828 |
Appears in Collections: | 化學工程學系 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.