https://scholars.lib.ntu.edu.tw/handle/123456789/432677
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lai Y. | en_US |
dc.contributor.author | Chang H. | en_US |
dc.contributor.author | Kao C. | en_US |
dc.contributor.author | C. ROBERT KAO | en_US |
dc.creator | C. ROBERT KAO;Kao C.R.;Kao C.;Chang H.;Lai Y. | - |
dc.date.accessioned | 2019-11-27T02:02:50Z | - |
dc.date.available | 2019-11-27T02:02:50Z | - |
dc.date.issued | 2009 | - |
dc.identifier.issn | 09540911 | - |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-68249085881&doi=10.1108%2f09540910910970358&partnerID=40&md5=3aae624f43d7dafe3d9b03813e6f3c80 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/432677 | - |
dc.relation.ispartof | Soldering & Surface Mount Technology | - |
dc.title | Effect of multiple reflow cycles on ball impact responses of SnAgCu solder joints | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1108/09540910910970358 | - |
dc.identifier.scopus | 2-s2.0-68249085881 | - |
dc.relation.pages | 4-9 | - |
dc.relation.journalvolume | 21 | - |
dc.relation.journalissue | 3 | - |
item.fulltext | no fulltext | - |
item.openairetype | journal article | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
crisitem.author.dept | Materials Science and Engineering | - |
crisitem.author.parentorg | College of Engineering | - |
顯示於: | 材料科學與工程學系 |
在 IR 系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。