https://scholars.lib.ntu.edu.tw/handle/123456789/432677
Title: | Effect of multiple reflow cycles on ball impact responses of SnAgCu solder joints | Authors: | Lai Y. Chang H. Kao C. C. ROBERT KAO |
Issue Date: | 2009 | Journal Volume: | 21 | Journal Issue: | 3 | Start page/Pages: | 4-9 | Source: | Soldering & Surface Mount Technology | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-68249085881&doi=10.1108%2f09540910910970358&partnerID=40&md5=3aae624f43d7dafe3d9b03813e6f3c80 https://scholars.lib.ntu.edu.tw/handle/123456789/432677 |
ISSN: | 09540911 | DOI: | 10.1108/09540910910970358 |
Appears in Collections: | 材料科學與工程學系 |
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