https://scholars.lib.ntu.edu.tw/handle/123456789/445796
Title: | Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads | Authors: | Jain, C. C. STEVEN SHENG-SHIH WANG Huang, K. W. TUNG-HAN CHUANG |
Issue Date: | 2009 | Journal Volume: | 18 | Journal Issue: | 2 | Start page/Pages: | 211-215 | Source: | Journal of Materials Engineering and Performance | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/445796 | ISSN: | 1059-9495 | DOI: | 10.1007/s11665-008-9292-7 |
Appears in Collections: | 化學工程學系 |
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