https://scholars.lib.ntu.edu.tw/handle/123456789/490973
Title: | Reliability of micro-interconnects in 3D IC packages | Authors: | Robert Kao, C. Wu, Albert T. Tu, King-Ning Lai, Yi-Shao C. ROBERT KAO |
Issue Date: | 2013 | Journal Volume: | 53 | Journal Issue: | 1 | Start page/Pages: | 1 | Source: | Microelectronics Reliability | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/490973 | ISSN: | 00262714 | DOI: | 10.1016/j.microrel.2012.11.005 |
Appears in Collections: | 材料科學與工程學系 |
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