Reliability of micro-interconnects in 3D IC packages

Journal

Microelectronics Reliability

Journal Volume

53

Journal Issue

1

Pages

1

Date Issued

2013

Author(s)

Robert Kao, C.

Wu, Albert T.

Tu, King-Ning

Lai, Yi-Shao

DOI

10.1016/j.microrel.2012.11.005

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/490973

URL

https://linkinghub.elsevier.com/retrieve/pii/S0026271412005136

Type

journal article