https://scholars.lib.ntu.edu.tw/handle/123456789/491966
Title: | Influence of glass transition temperature of underfill on the stress behavior and reliability of microjoints within a chip stacking architecture | Authors: | Chang, J.-Y. Huang, S.-Y. Lee, C.-C. Chuang, T.-H. Chang, T.-C. TUNG-HAN CHUANG |
Issue Date: | 2015 | Journal Volume: | 137 | Journal Issue: | 3 | Source: | Journal of Electronic Packaging, Transactions of the ASME | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/491966 | DOI: | 10.1115/1.4030392 |
Appears in Collections: | 材料科學與工程學系 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.