https://scholars.lib.ntu.edu.tw/handle/123456789/492168
Title: | Eutectic bonding of copper to ceramics for thermal dissipation applications - A review | Authors: | Tuan, W.-H. Lee, S.-K. WEI-HSING TUAN |
Issue Date: | 2014 | Journal Volume: | 34 | Journal Issue: | 16 | Start page/Pages: | 4117-4130 | Source: | Journal of the European Ceramic Society | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/492168 | DOI: | 10.1016/j.jeurceramsoc.2014.07.011 |
Appears in Collections: | 材料科學與工程學系 |
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