https://scholars.lib.ntu.edu.tw/handle/123456789/546626
Title: | Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver�Vindium multilayer structure | Authors: | Sheikhi, R. Huo, Y. Tsai, C.-H. Kao, C.R. Shi, F.G. Lee, C.C. C. ROBERT KAO |
Issue Date: | 2020 | Journal Volume: | 31 | Journal Issue: | 10 | Start page/Pages: | 8059-8071 | Source: | Journal of Materials Science: Materials in Electronics | URI: | https://www.scopus.com/inward/record.url?eid=2-s2.0-85084088997&partnerID=40&md5=20934cceb2fa36de7fc5a6fc4c88d968 https://scholars.lib.ntu.edu.tw/handle/123456789/546626 |
DOI: | 10.1007/s10854-020-03346-2 |
Appears in Collections: | 材料科學與工程學系 |
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