https://scholars.lib.ntu.edu.tw/handle/123456789/547492
Title: | Thermal performance analysis of a package using non-simulation technique | Authors: | Chien, H.-C. Huang, M.-J. Chen, Z.-Z. MEI-JIAU HUANG |
Issue Date: | 2020 | Start page/Pages: | 76-77 | Source: | 2020 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2020 | URI: | https://www.scopus.com/inward/record.url?eid=2-s2.0-85093661569&partnerID=40&md5=d9787d9fbd8318914fa1f7d964bbc067 https://scholars.lib.ntu.edu.tw/handle/123456789/547492 |
ISSN: | Chien, H.-C.;Huang, M.-J.;Chen, Z.-Z. | DOI: | 10.1109/VLSI-TSA48913.2020.9203733 |
Appears in Collections: | 機械工程學系 |
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