https://scholars.lib.ntu.edu.tw/handle/123456789/559276
Title: | Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems | Authors: | Weng, P.-Y. Cheng, C.-H. Wu, T.-L. Chen, C. Chen, J. Kuo, E. Liao, C.-L. Mutnury, B. TZONG-LIN WU |
Issue Date: | 2019 | Source: | 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019 | URI: | https://www.scopus.com/inward/record.url?eid=2-s2.0-85084540143&partnerID=40&md5=30482b63a7daaffc0bf72b941779b614 https://scholars.lib.ntu.edu.tw/handle/123456789/559276 |
DOI: | 10.1109/EPEPS47316.2019.193236 |
Appears in Collections: | 電機工程學系 |
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