https://scholars.lib.ntu.edu.tw/handle/123456789/606997
標題: | A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs | 作者: | Huang C.-P Lee T.-Y Yang J.-J Lin G.-T CHIEN-CHUNG LIN |
關鍵字: | heat;light-emitting diodes;Quantum dot;Nanocrystals;Photonic devices;Semiconductor quantum dots;Colloidal quantum dots;Heat distribution;Optical intensities;Packaging structure;Performance enhancements;Radiant flux;Reliability management;Three folds;Organic light emitting diodes (OLED) | 公開日期: | 2021 | 卷: | 13 | 期: | 4 | 來源出版物: | IEEE Photonics Journal | 摘要: | A Sn-ball was integrated with a colloidal quantum dot light-emitting diode package to achieve effective heat and reliability management. The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging. Under 1 W/cm2, the areal temperature decreased from 38.5 °C (without Sn-ball) to 32.3 °C (with Sn-ball), which helped extend the lifetime of the colloidal quantum dots in the package. Specifically, the introduction of the metal ball structure engendered a two- to three-fold increase in lifetime. The study findings could contribute toward integrating quantum dots into photonic devices. ? 2009-2012 IEEE. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85111565791&doi=10.1109%2fJPHOT.2021.3099313&partnerID=40&md5=4cbb0bc6cec383bb97415d3afc652d13 https://scholars.lib.ntu.edu.tw/handle/123456789/606997 |
ISSN: | 19430655 | DOI: | 10.1109/JPHOT.2021.3099313 |
顯示於: | 電機工程學系 |
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