https://scholars.lib.ntu.edu.tw/handle/123456789/607123
標題: | Antenna-in-Packages for Array Modularization at Millimeter-wave Frequencies and its Applications in 5G O-RAN | 作者: | Chou H.-T Wu K.-H Lin Z.-H Yan Z.-D Lin D.-B. HSI-TSENG CHOU |
關鍵字: | Antenna array;antennas-in-package;design considerations;dielectric substrates;LTCC;millimeter-wave frequencies;SiP;5G mobile communication systems;Antenna arrays;Dielectric properties;Directional patterns (antenna);Millimeter waves;Modular construction;Silicon compounds;'current;Antenna in packages;Design considerations;Design issues;Dielectric substrates;Frequency applications;ITS applications;Millimeter wave frequencies;Modularizations;System-in-package | 公開日期: | 2021 | 來源出版物: | 2021 International Symposium on Antennas and Propagation, ISAP 2021 | 摘要: | In this paper, the design issues of antenna-in-package (AiP) is discussed to modularize arrays at millimeter-wave (mmW) frequencies for 5G applications. The current progress of AiP technologies at NTU is also summarized. The issues of considerations include different fabrication process, dielectric property deviation and mechanical limitations to realize the antenna structure. Antenna designs for various applications, ranging from user equipment, CPE to small cell BTS antennas, have been developed at different sizes. The radiation characteristics of these AiPs will be presented to demonstrate the behaviors of AiPs using these processes. Both full-wave simulations and experimental measurements will be presented to validate the AiP designs. ? 2021 Taiwan Microwave Association. |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85123321167&doi=10.23919%2fISAP47258.2021.9614538&partnerID=40&md5=4c97da987a3bed8dd1671627db38a439 https://scholars.lib.ntu.edu.tw/handle/123456789/607123 |
DOI: | 10.23919/ISAP47258.2021.9614538 |
顯示於: | 電機工程學系 |
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