https://scholars.lib.ntu.edu.tw/handle/123456789/632511
標題: | Sensitivity of Dielectric Substrate Property Discrepancy and Metal Microstrip Roughness to the Electronic Characteristics of Antenna-in-Packaging for 5G Applications at Millimeter-Wave Frequencies | 作者: | Wu K.-H Lin Z.-H HSI-TSENG CHOU Shen P.-Z Lin D.-B Yang C.-S Chou C.-W Pan C.-L Lin J.-C Fang L.-C. |
關鍵字: | Active antenna array; Antenna-in-package; Broadside radiation; End-fire radiation; Millimeter-wave frequency; The fifth generation of mobile communication | 公開日期: | 2021 | 卷: | 2021-June | 起(迄)頁: | 577-582 | 來源出版物: | Proceedings - Electronic Components and Technology Conference | 摘要: | Realization of Antenna-in-Package (AiP) needs to resolve several performance instability challenges at millimeter-wave (mmW) frequencies. They are caused by the uncertainties of material properties and mechanical fabrication limitations. In particular, the material properties are highly dependent on frequencies and may exhibit properties of magnetization. Besides, the physical sizes of wavelength at mmW frequencies are very small, making the discrepancy by mechanical fabrications large to cause degradation to the AiP's radiation performance. The roughness of the metal surface may also cause performance degradation, which cannot be avoided due to adherence to the dielectric substrates. These potential performance degradation factors arc examined in this paper by considering practical AiPs at 38 GHz bands. Comparisons between full-wave simulations and experimental measurements over AiP prototypes are performed to justify materials and fabrications' influencing factors. © 2021 IEEE |
URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85124668564&doi=10.1109%2fECTC32696.2021.00102&partnerID=40&md5=f13e87f77bb7fa8b8ca635eba36a988f https://scholars.lib.ntu.edu.tw/handle/123456789/632511 |
ISSN: | 5695503 | DOI: | 10.1109/ECTC32696.2021.00102 | SDG/關鍵字: | 5G mobile communication systems; Antenna arrays; Chip scale packages; Dielectric materials; Microstrip antennas; Microwave antennas; Millimeter waves; Surface roughness; Active antenna arrays; Antenna in packages; Broadside radiations; Dielectric substrates; End-fire; End-fire radiation; Fire radiation; Millimeter wave frequencies; Mobile communications; The fifth generation of mobile communication; Substrates |
顯示於: | 電機工程學系 |
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