https://scholars.lib.ntu.edu.tw/handle/123456789/75180
Title: | Characterization of Intermetallic Compounds formed during the Interfacial Reactions of Liquid Su and Sn-58Bi Solders with Ni Substrates | Authors: | Chiu, M. Y. Chang, S. Y. Tseng, Y. H. Chan, Y. C. Chuang, T. H. |
Issue Date: | 2002 | Start page/Pages: | 248-252 | Source: | Zeitschrift fur Metallkunde 93: | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/95928 |
Appears in Collections: | 材料科學與工程學系 |
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