https://scholars.lib.ntu.edu.tw/handle/123456789/75583
Title: | Cross-interaction of UBM and soldering pad in flip-chip solder joints | Authors: | Tsai, C. M. Luo, W. C. Chang, C. W. Shieh, Y. C. Kao, and C. R. |
Issue Date: | Dec-2004 | Journal Volume: | 33 | Journal Issue: | 12 | Start page/Pages: | 1424-1428 | Source: | Journal of Electronic Materials | URI: | http://ntur.lib.ntu.edu.tw//handle/246246/198765 |
Appears in Collections: | 材料科學與工程學系 |
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