公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2022 | Microstructure evolution and failure mechanism of electromigration in Ag-alloy bonding wire | Chen C.-H; Lee P.-I; TUNG-HAN CHUANG | Journal of Alloys and Compounds | 7 | 6 | |
2016 | Microstructures and optoelectronic properties of Cu<inf>x</inf>O films deposited by high-power impulse magnetron sputtering | Sun, H.; Wen, C.-K.; Chen, S.-C.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2017 | Microstructures and optoelectronic properties of nickel oxide films deposited by reactive magnetron sputtering at various working pressures of pure oxygen environment | Sun, H.; Chen, S.-C.; Hsu, S.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; TUNG-HAN CHUANG | Ceramics International | | | |
2016 | Microstructures, electrical and magnetic properties of (Ga, Co)-ZnO films by radio frequency magnetron co-sputtering | Chen, S.-C.; Wang, C.-H.; Sun, H.; Wen, C.-K.; Lu, C.-F.; Tsai, C.-L.; Fu, Y.-K.; Chuang, T.-H.; TUNG-HAN CHUANG | Surface and Coatings Technology | | | |
2002 | Morphology and growth kinetics of Ag<inf>3</inf>Sn during soldering reaction between liquid Sn and an Ag substrate | Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
2003 | Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy | Chang, S.-Y.; Wang, S.-S.; Tsao, L.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
1986 | The morphology of discontinuous precipitation on the surface of NiIn and NiSn alloys | Chuang, T.H.; Fournelle, R.A.; Gust, W.; Predel, B.; TUNG-HAN CHUANG | Scripta Metallurgica | | | |
2011 | Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy | TUNG-HAN CHUANG ; Jain, Chao-Chi | Metallurgical and Materials Transactions A | 5 | 4 | |
1991 | The mutual effects of boron, zirconium and aluminium on grain boundary segregation in Ni<inf>3</inf>Al intermetallic compounds | Chuang, T.H.; TUNG-HAN CHUANG | Materials Science and Engineering A | | | |
2014 | Nickel-tin solid-liquid inter-diffusion bonding | Yu, C.-C.; Su, P.-C.; Bai, S.J.; Chuang, T.-H.; TUNG-HAN CHUANG | International Journal of Precision Engineering and Manufacturing | | | |
1988 | Nontraditional grain refinement through phase transformation in an Al-Zn alloy | Chuang, T.-W.; Chen, S.-J.; TUNG-HAN CHUANG | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | | | |
1982 | Observations of fracture surface chemistry on Cu-0.5 At. % Sb bicrystals | Chuang, T.H.; Gust, W.; Heldt, L.A.; Hintz, M.B.; Hofmann, S.; Lu?i?, R.; Predel, B.; TUNG-HAN CHUANG | Scripta Metallurgica | | | |
1992 | On the mechanisms of high-temperature intergranular embrittlements of Ni3Al-Zr Alloys | Chuang, T. H.; Pan, Y. C.; ChuangTH | Metallurgical and Materials Transactions A23 | | | |
1992 | On the mechanisms of high-temperature intergranular embrittlements of Ni<inf>3</inf>Al-Zr Alloys | Chuang, T.H.; Pan, Y.C.; TUNG-HAN CHUANG | Metallurgical Transactions A | | | |
2022 | Optimization of Ag-alloy ribbon bonding — An approach to reliable interconnection for high power IC packaging | CHUN-HAO CHEN; TUNG-HAN CHUANG | Microelectronics Reliability | 1 | 3 | |
2020 | An Optimized Ag-5Pd-3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages | Chuang T.-H; Lee P.-I; Lin Y.-C.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
1996 | The oxidation behavior of Ni<inf>3</inf>Al-Zr alloys with various zirconium contents | Chang, T.T.; Pan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2007 | Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy | Chuang, Tung-Han ; Lin, Hsiu-Jen; Chi, Chih-Chien | Journal of Electronic Materials | 7 | | |
2017 | p-type cuprous oxide thin films with high conductivity deposited by high power impulse magnetron sputtering | Sun, H.; Chen, S.-C.; Wen, C.-K.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG | Ceramics International | | | |
2020 | p-type semi-transparent conductive NiO films with high deposition rate produced by superimposed high power impulse magnetron sputtering | Chuang, T.-H.; Wen, C.-K.; Chen, S.-C.; Liao, M.-H.; Liu, F.; Sun, H.; MING-HAN LIAO ; TUNG-HAN CHUANG | Ceramics International | | 10 | |