公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2020 | Lattice buffer effect of Ti film on the epitaxial growth of Ag nanotwins on Si substrates with various orientations | Chuang, T.-H.; Wu, P.-C.; Lin, Y.-C.; TUNG-HAN CHUANG | Materials Characterization | | | |
1991 | Long-term oxidation behaviour of Ni<inf>3</inf>Al alloys with and without chromium additions | Pan, Y.C.; Chuang, T.H.; Yao, Y.D.; TUNG-HAN CHUANG | Journal of Materials Science | | | |
2007 | Low temperature bonding of alumina/alumina and alumina/copper in air using Sn3.5Ag4Ti(Ce,Ga) filler | Chang, S.Y.; Chuang, T.H.; Yang, C.L.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2016 | Low temperature bonding of Pd/Ni assembly for hydrogen purifier | Lin, Y.-C.; Chuang, C.-H.; Tsai, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | | | |
2023 | Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films | Lai, Yu Chang; Yang, Zi Hong; Chen, Yin Hsuan; Chen, Yen Ting; Lin, Ang Ying; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | 0 | 0 | |
2008 | Low Temperature Direct Electroless Nickel Plating on Silicon Wafer | Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han ; Yang, Sang-Ray | Journal of the Chinese Institute of Engineers | | | |
2009 | Low temperature direct electroless nickel plating on silicon wafer | Jain, C.-C.; Wang, S.-S.; Chuang, T.-H.; Yang, S.-R.; TUNG-HAN CHUANG | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | | | |
1995 | Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayer | Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG | Scripta Metallurgica et Materiala | | | |
2016 | Low-Temperature Bonding of Bi<inf>0.5</inf>Sb<inf>1.5</inf>Te<inf>3</inf> Thermoelectric Material with Cu Electrodes Using a Thin-Film In Interlayer | Lin, Y.-C.; Yang, C.-L.; Huang, J.-Y.; Jain, C.-C.; Hwang, J.-D.; Chu, H.-S.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2023 | Low-Temperature Die Bonding of SiC Chips with DBC Ceramic Substrates Using High-Density Ag (111) Nanotwinned Films | TUNG-HAN CHUANG ; Yang, Zi Hong; Chen, Yen Ting; Chen, Yin Hsuan | Journal of Materials Engineering and Performance | 0 | 0 | |
2020 | Lumen maintenance of ternary Ag-alloy wire bonded LED package after reliability tests | Yuan, J.-H.; Chuang, T.-H.; Chuang, J.-H.; TUNG-HAN CHUANG | Materials Science Forum | | | |
2019 | Luminous efficiency of pd-doped ag-alloy wire bonded led package after reliability tests | Yuan, J.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | Materials Science Forum | | | |
2015 | Magnetic pinning effect in YBa2Cu3O7-d/Nd0.35Sr0.65MnO3 bilayer | Cheng, S.; Lin, J. ; TUNG-HAN CHUANG | 2015 IEEE International Magnetics Conference, INTERMAG 2015 | 0 | 0 | |
1990 | Magnetization study on grain-boundary precipitation in a Ni-8 at. % Sn alloy | Yao, Y.D.; Chen, Y.Y.; Li, T.J.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Applied Physics | | | |
2016 | Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages | Tsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2006 | Mechanical properties of intermetallic compounds on lead-free solder by moiré techniques | Tsai, I.; Wu, E.; Yen, S.F.; TUNG-HAN CHUANG | Journal of Electronic Materials | 19 | 17 | |
2014 | Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au Content | Chuang, T.-H.; Lin, H.-J.; Wang, H.-C.; Chuang, C.-H.; Tsai, C.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2018 | Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires | Chuang, T.-H.; Chen, C.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2004 | Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates | Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH | Journal of Electronic Materials | | | |
2004 | Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions | Chuang, T. H.; Huang, K. W.; Lin, W. H.; ChuangTH | Journal of Electronic Materials | | | |