公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2018 | HBM3 PPA Performance Evaluation by TSV Model with Micro-Bump and Hybrid Bonding | Huang, Li Hsin; Cheng, Yu Ying; TZONG-LIN WU | EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems | | | |
2005 | High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure | H.-C. Kuo; S.-T. Chen; C.-C. Wang; S.-W. Wen; H.-C. Li; C.-C. Chien; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | | | |
2005 | High electromagnetic shielding of plastic package for 2.5Gbps optical transceiver modules | TZONG-LIN WU ; C.-W. Lin; W.-C. Hung; C.-H. Lee; W.-S. Jou; W.-H. Cheng | IEEE Transactions on Advanced Packaging | | | |
2005 | High electromagnetic susceptibility (EMS) plastic package for 10Gbps optical transceiver module | TZONG-LIN WU ; M.-C. Lin; C.-H. Lee; T.-T. Shih; W.-H. Cheng | Electronics Letters(SCI) | | | |
2019 | A High-Performance Common-Mode Noise Absorption Circuit Based on Phase Modification Technique | Chan, C.-K.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | | | |
2009 | Impact of Photonic Crystal Power/Ground Layer density on power integrity performance of high-speed power buses | Scogna, A.C.; Orlandi, A.; Ricchiuti, V.; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | | | |
2020 | An Improved Method of Finding Complex Permittivity of Lossy Liquids | Liu R.-J; Chou C.-C; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | 0 | 0 | |
2019 | Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems | Weng, P.-Y.; Cheng, C.-H.; Wu, T.-L.; Chen, C.; Chen, J.; Kuo, E.; Liao, C.-L.; Mutnury, B.; TZONG-LIN WU | 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019 | | | |
2006 | Improving the radiated immunity of the strip-lines using a novel hybrid EBG structure | H.-C. Kuo; S.-T. Chen; TZONG-LIN WU | IEEE Elect. Performance Electron. Package. Systems | | | |
2015 | Investigation of signal integrity issues in multi-path electrostatic discharge protection device | Huang, Y.-C.; Wu, T.-L.; Chen, C.-H.; TZONG-LIN WU | 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, EMCSI 2015 | | | |
2001 | Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement | Y.-H. Lin; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | | | |
2016 | Investigation of the Radiated Emissions From High-Speed/High-Density Connectors | H.-C. Chen; S. Connor; M. S. Halligan; X. Tian; X. Li; B. Archambeault; J. L. Drewniak; T.-L. Wu; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 7 | 7 | |
2018 | Investigation on Degradation of Common Mode Noise Suppression with Electrostatic Discharge Protection Array | C.-Y. Lin; TZONG-LIN WU | International Symposium on Electromagnetic Compatibility - EMC EUROPE | 0 | 0 | |
2004 | Low cost and low electromagnetic interference packaging of optical transceiver modules | W.-H. Cheng; W.-C.Hung; C.-H. Lee; G.-L. Hwang; W.-S. Jou; TZONG-LIN WU | Journal of Lightwave Technology(SCI) | 27 | 20 | |
2008 | A low cost dual-CPW differential line for two-layer PCBs | Chi, C.-J.; Chih-Wei, T.; Hsieh, J.-S.; Ko, W.-C.; TZONG-LIN WU | 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008 | | | |
2012 | Low slow-wave effect and crosstalk for low-cost ABF-coated TSVs in 3-D IC interposer | YI-CHANG LU ; TZONG-LIN WU ; YIH-PENG CHIOU | Electronic Components and Technology Conference | | | |
2023 | A Low-Loss Via-Free Ridge Air-Filled Substrate Integrated Waveguide on Printed Circuits Board for mmWave Application | Ting, Cheng Wu; Liu, Hsu Wei; Liao, Chung Hsing; Lee, Chien Cheng; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 0 | | |
2011 | Magneto-resistive sensor readout circuit and field canceling system in next generation nano-fab | F.-C. Chuang; Y.-L. Song; C. Yu; S.-K. Hsu; T.-L. Wu; L.-M. Chang; TZONG-LIN WU | Asia-Pacific Int. Symp. Electronmagn. Compat. | | | |
2018 | Message from the Incoming Editor-in-Chief | TZONG-LIN WU | Ieee Transactions on Electromagnetic Compatibility | | | |
2018 | A Miniature Electromagnetic Bandgap Structure Using Integrated Fan-Out Wafer-Level Package (InFO-WLP) for Gigahertz Noise Suppression | M.-H. Tsai; S.-K. Hsu; C.-K. Shen; P.-S. Wei; C.-H. Chern; T.-L. Wu; TZONG-LIN WU | IEEE/MTT-S International Microwave Symposium | 3 | 0 | |