https://scholars.lib.ntu.edu.tw/handle/123456789/638616
標題: | HBM3 PPA Performance Evaluation by TSV Model with Micro-Bump and Hybrid Bonding | 作者: | Huang, Li Hsin Cheng, Yu Ying TZONG-LIN WU |
關鍵字: | high bandwidth memory (HBM) | hybrid bonding | PPA | Signal integrity (SI) | through-silicon via (TSV) | 公開日期: | 1-一月-2018 | 來源出版物: | EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems | 摘要: | In this paper, through-silicon via (TSV) circuit models for the third generation of high bandwidth memory (HBM3) are developed utilizing 3D IC stacking technology with micro-bump or hybrid bonding. A good agreement between the results of the equivalent model and the full-wave simulation would be seen. In addition, the power, performance, and area (PPA) metrics of both stacking techniques are analyzed and compared. In all aspects, the hybrid bonding technique is more effective. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/638616 | ISBN: | 9798350317985 | DOI: | 10.1109/EPEPS58208.2023.10314903 |
顯示於: | 電機工程學系 |
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