公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2017 | Enhancement of CMOS THz imaging sensing by packaging technology | Chien-Nan Kuo; Wei-Cheng Chen; Te-Yen Chiu; and Chun-Hsing Li; CHUN-HSING LI | 2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) | 0 | 0 | |
2020 | A low-loss balun-embedded interconnect for THz heterogeneous system integration | Te-Yen Chiu; Yu-Ling Lee; Chun-Lin Ko; Sheng-Hsiang Tseng; CHUN-HSING LI | International Microwave Symposium | 1 | 0 | |
2018 | A silicon-based parabolic sub-THz reflector antenna for gain enhancement and near-field focus applications | Meng-Tse Hsu; Te-Yen Chiu; Syuan-Yu Wu; Yu-Ting Cheng; Chun-Hsing Li; and Chien-Nan Kuo; CHUN-HSING LI | Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) | 3 | 0 | |
2019 | Single flip-chip packaged dielectric resonator antenna for CMOS terahertz antenna array gain enhancement | Chun-Hsing Li; Te-Yen Chiu; CHUN-HSING LI | IEEE Access | 16 | 15 |