Enhancement of CMOS THz imaging sensing by packaging technology

Journal

2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)

Pages

22-24

Date Issued

2017

Author(s)

Chien-Nan Kuo

Wei-Cheng Chen

Te-Yen Chiu

and Chun-Hsing Li

DOI

URI

Type

conference paper