Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
2017 | Effective energy-saving device of Eco-Ship by using wave propulsion | Huang, S.-W.; Wu, T.-L.; Hsu, Y.-T.; Guo, J.-H.; Tsai, J.-F.; FORNG-CHEN CHIU ; JEN-HWA GUO ; JING-FA TSAI | Techno-Ocean 2016: Return to the Oceans | 7 | 0 | |
2019 | Enhanced power and signal integrity through layout optimization of high-speed memory systems | Weng, P.-Y.; Cheng, C.-H.; Wu, T.-L.; Chen, C.-H.; Chen, J.; Kuo, E.; Liao, C.-L.; Mutnury, B.; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | | | |
1992 | Equivalent circuit of a through via in multi-layer environment | Chang, K.K.; Kuo, C.-N.; Wu, T.-L.; Chen, W.-L.; Wu, R.-B.; TZONG-LIN WU | Electrical Performance of Electronic Packaging, EPEP 1992 | | | |
2018 | Factors affecting near-end crosstalk (NEXT) in high speed serial links | Weng, P.-Y.; Chen, C.-H.; Chen, C.-H.; Liao, C.-L.; Wu, T.-L.; Mutnury, B.; TZONG-LIN WU | 15th International Conference on Electromagnetic Interference and Compatibility, INCEMIC 2018 | | | |
2009 | High voltage lateral 4H-SiC JFETs on a semi-insulating substrate | Huang, C.-F.; Kan, C.-L.; Wu, T.-L.; Lee, M.-C.; Liu, Y.-Z.; Lee, K.-Y.; Zhao, F.; KUNG-YEN LEE | Device Research Conference | | | |
2019 | Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems | Weng, P.-Y.; Cheng, C.-H.; Wu, T.-L.; Chen, C.; Chen, J.; Kuo, E.; Liao, C.-L.; Mutnury, B.; TZONG-LIN WU | 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019 | | | |
2015 | Investigation of signal integrity issues in multi-path electrostatic discharge protection device | Huang, Y.-C.; Wu, T.-L.; Chen, C.-H.; TZONG-LIN WU | 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, EMCSI 2015 | | | |
2018 | Modularized prototype of 5G mmWave base station system at 38 GHz | Yen, L.-H.; Huang, Y.-C.; Su, S.-H.; Fan, C.-Y.; Chu, F.-H.; Kuo, F.-Y.; Lu, H.-C.; Mao, S.-G.; Lin, K.-Y.; Yen, T.-C.; Wu, T.-L.; SHAU-GANG MAO | 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 | | | |
2012 | Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design | Chang, Y.-J.; Chuang, H.-H.; Lu, Y.-C.; Chiou, Y.-P.; Wu, T.-L.; Chen, P.-S.; Wu, S.-H.; Kuo, T.-Y.; Zhan, C.-J.; Lo, W.-C.; YI-CHANG LU ; TZONG-LIN WU | 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 | | | |
2005 | A novel ultraflattened dispersion photonic crystal fiber | Wu, T.-L.; Chao, C.-H.; TZONG-LIN WU | IEEE Photonics Technology Letters | | | |
2013 | Power distribution network modeling for 3-D ICs with TSV arrays | Shen, C.-K.; Lu, Y.-C.; Chiou, Y.-P.; Cheng, T.-Y.; Wu, T.-L.; YI-CHANG LU ; TZONG-LIN WU | Asia and South Pacific Design Automation Conference, ASP-DAC | | | |
2016 | Promoting Effective Education in Electromagnetics: Taiwan's School of Accessible and Visualized Electromagnetics Formed [Education Corner] | Liao, W.-J.; Wu, R.-B.; Wu, T.-L.; Ma, T.-G.; Pang, Y.-H.; Tsai, Z.-M.; Yu, H.-H.; Tu, K.-M.; Lin, H.-C.; TZONG-LIN WU ; RUEY-BEEI WU | IEEE Antennas and Propagation Magazine | 5 | 4 | |
2014 | Recent progress of advanced microwave and system-in-package integration technologies at National Taiwan University | Wang, H.; Wu, T.-L.; Hsu, P.; Wu, R.-B.; Lin, K.-Y.; Huang, T.-W.; KUN-YOU LIN | 2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014 | | | |
2015 | SAVE and iEMPT: The em revitalization program in Taiwan | Ma, T.-G.; Liao, W.-J.; Chen, S.-Y.; Wu, T.-L.; Wu, R.-B.; Hsu, H.-T.; Peng, S.T.; Tsai, Z.-M.; Pang, Y.-H.; Yu, H.-H.; Tu, J.-M.; RUEY-BEEI WU ; TZONG-LIN WU ; SHIH-YUAN CHEN | IEEE Antennas and Propagation Society, AP-S International Symposium (Digest) | 0 | 0 | |
2008 | Special issue on URSI/SRS 2007 Radio Science Conference | Wu, T.-L.; Chou, H.-T.; Hsu, H.-T.; HSI-TSENG CHOU | International Journal of Electrical Engineering | | | |
2016 | Study of frequency offset behavior for artificial magnetic structure in compact mobile device | Liu, C.-Y.; Shen, C.-K.; Chen, S.-Y.; Wu, T.-L.; Chang, J.; Tseng, B.-C.; Yen, J.; SHIH-YUAN CHEN | 2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016 - Proceedings | | | |
2003 | Telithromycin and Quinupristin-Dalfopristin Resistance in Clinical Isolates of Streptococcus Pyogenes: Smart Program 2001 Data | Hsueh, P.-R.; Teng, L.-J.; Lee, C.-M.; Huang, W.-K.; Wu, T.-L.; Wan, J.-H.; Yang, D.; Shyr, J.-M.; Chuang, Y.-C.; Yan, J.-J.; Lu, J.-J.; Wu, J.-J.; Ko, W.-C.; Chang, F.-Y.; Yang, Y.-C. | ANTIMICROBIAL AGENTS AND CHEMOTHERAPY | | | |
2013 | Test generation of path delay faults induced by defects in power TSV | Shih, C.-J.; Hsieh, S.-A.; Lu, Y.-C.; Li, J.C.-M.; Wu, T.-L.; TZONG-LIN WU ; YI-CHANG LU ; CHIEN-MO LI | Proceedings of the Asian Test Symposium | 2 | 0 | |