公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2002 | Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate | Chiang, M. J.; Chuang, T. H. | Zeitschrift fur Metallkunde | |||
2004 | Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad | Chiang, M. J.; Chang, S. Y.; Chuang, T. H. | Journal of Electronic Materials |