公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1997 | Effects of post-weld heat treatments on the residual stress and mechanical properties of laser beam welded SAE 4130 steel plates | Huang, C.C.; Chuang, T.H.; TUNG-HAN CHUANG | Materials and Manufacturing Processes | | | |
2022 | Effects of substrate bias on the sputtering of high density (111)-nanotwinned Cu films on SiC chips | Yang, Zi Hong; Wu, Po Ching; TUNG-HAN CHUANG | Scientific Reports | 7 | 5 | |
1999 | Effects of Superplastic Deformation on the Diffusion Welding of SuperDux 65 Stainless Steel | Yeh M.S; Tseng Y.H; TUNG-HAN CHUANG | Welding Journal (Miami, Fla) | 7 | | |
2002 | Effects of zinc additions on the microstructure and melting temperatures of Al-Si-Cu filler metals | Tsao, L.C.; Chiang, M.J.; Lin, W.H.; Cheng, M.D.; Chuang, T.H.; TUNG-HAN CHUANG | Materials Characterization | | | |
2019 | Electrical and magnetic properties of (Al, Co) co-doped ZnO films deposited by RF magnetron sputtering | Sun, H.; Chen, S.-C.; Wang, C.-H.; Lin, Y.-W.; Wen, C.-K.; Chuang, T.-H.; Wang, X.; Lin, S.-S.; Dai, M.-J.; TUNG-HAN CHUANG | Surface and Coatings Technology | | | |
1989 | Electrical and Magnetic Studies on Grain Boundary Segregation in a NI-3AT.%Sn Alloy | Yao, Y.D.; Chuang, T.H.; Lee, C.K.; TUNG-HAN CHUANG | IEEE Transactions on Magnetics | | | |
1990 | Electrical Resistivity of Nickel‐Rich Nickel‐Indium Alloys between 10 and 800 K | Tzeng, S.J.; Yao, Y.D.; Chuang, T.H.; TUNG-HAN CHUANG | physica status solidi (a) | | | |
1990 | Electrical resistivity, magnetization, and grain boundary precipitates in NiSn alloys | Yao, Y.D.; Chen, Y.Y.; Tzeng, S.J.; Chuang, T.H.; TUNG-HAN CHUANG | physica status solidi (a) | | | |
1991 | Electrical resistivity, magnetization, and grain-boundary precipitate in nickel-rich nickel-indium alloys | Yao, Y.D.; Chen, Y.Y.; Chuang, T.H.; Kung, C.; Lin, C.J.; TUNG-HAN CHUANG | Journal of Applied Physics | | | |
2018 | Electrolytic Migration of Ag-Pd Alloy Wires with Various Pd Contents | Lin, Y.-C.; Chen, C.-H.; He, Y.-Z.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2007 | Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads | Lin, W.H.; Wu, A.T.; Lin, S.Z.; Chuang, T.H.; Tu, K.N.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2009 | Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads | Lin, H.-J.; Lin, J.-S.; Chuang, T.-H.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2008 | Enhanced growth of anodic alumina nanochannels on Ga-ion pre-irradiated aluminum | Liu, C.Y.; Datta, A.; Liu, N.W.; Wu, Y.R.; Wang, H.H.; Chuang, T.H.; YUH-RENN WU ; TUNG-HAN CHUANG | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures | 5 | 5 | |
2021 | Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films | Wu P.-C; Lai Y.-C; Chuang T.-H.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | | | |
1999 | Erosion of SS41 steel by sand blasting | Fang, C.-K.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2000 | Erosion- and wear-corrosion behavior of Fe-Mn-Al alloys in NaC1 solution | Huang, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | Materials Science and Engineering A | | | |
2000 | Erosion- and wear-corrosion behavior of Fe–Mn–Al alloys in NaCl solution | Huang, Her-Hsiung; Chuang, Tung-Han | Materials Science and Engineering A | | | |
2004 | Erratum: Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu solder ball grid arrav packaaes(Journal of Electronics Materials (March 2004) 33 (171-180)) | Cheng, M.D.; Chang, S.Y.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2018 | Evaluation of corrosion resistance of ag-alloy bonding wires for electronic packaging | Chen, C.-H.; Lin, Y.-C.; Shih, Y.-T.; Chen, S.-C.; Tsai, C.-H.; Wang, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
1999 | Evaluation of superplastic formability for a 5083 Al-Mg alloy | Tseng Y.-H; TUNG-HAN CHUANG | Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques | 3 | | |