Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads

Journal

Journal of Electronic Materials

Journal Volume

36

Journal Issue

7

Pages

753-759

Date Issued

2007

Author(s)

Lin, W.H.

Wu, A.T.

Lin, S.Z.

Chuang, T.H.

Tu, K.N.

TUNG-HAN CHUANG

DOI

10.1007/s11664-007-0139-z

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492006

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-34547456938&doi=10.1007%2fs11664-007-0139-z&partnerID=40&md5=2b41c544586c9b0866d221808ff2a382

Type

journal article