公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2007 | Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy | Chuang, T.H.; Lin, H.J.; Chi, C.C.; TUNG-HAN CHUANG | Scripta Materialia | | | |
2007 | Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloy | Chuang, T.H.; Lin, H.J.; Chi, C.C.; ChuangTH | Scripta Materialia | | | |
2006 | Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints | Chuang, T.-H.; TUNG-HAN CHUANG | Scripta Materialia | | | |
2006 | Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints | Chuang, Tung-Han | Scripta Materialia | | | |
1999 | Recent research and development activities on superplasticity in Taiwan | Huang, J. C.; Chuang, T. H.; TUNG-HAN CHUANG | Towards Innovation in Superplasticity Ii | | | |
2004 | Reflow and Burn-in of a Sn-20ln-0.8Cu Ball Grid Array Package with a Au/Ni/Cu Pad | Chiang, M.J.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
1998 | Relationship between wettability and interfacial reaction for Sn10Ag4Ti on Al<inf>2</inf>O<inf>3</inf> and SiC substrates | Chai, Y.H.; Weng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG | Ceramics International | | | |
2012 | Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture | Chang, Jing-Yao; Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Tao-Chih; Chuang, Tung-Han | IEEE Transactions on Components, Packaging and Manufacturing Technology | 29 | 24 | |
1997 | Role of grain size on the stress corrosion cracking of 7475 aluminum alloys | Tsai T.C; TUNG-HAN CHUANG | Materials Science and Engineering A | 133 | 99 | |
2004 | Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes | Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han | Journal of Electronic Materials | 6 | | |
2008 | Size effect of rare-earth intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce solders on the growth of tin whiskers | Chuang, T.H.; Lin, H.J.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2002 | Soldering reactions between In49Sn and Ag thick films | Cheng, M.D.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2014 | Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer | Chuang, T.H.; Lin, H.J.; Chuang, C.H.; Yeh, W.T.; Hwang, J.D.; Chu, H.S.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2016 | Solid Liquid Interdiffusion Bonding of Zn<inf>4</inf>Sb<inf>3</inf> Thermoelectric Material with Cu Electrode | Lin, Y.C.; Lee, K.T.; Hwang, J.D.; Chu, H.S.; Hsu, C.C.; Chen, S.C.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2017 | Spin Diffusion Length in Ferromagnet/Superconductor Bilayers | Cheng, S. L.; Chuang, T. H.; TUNG-HAN CHUANG | IEEE Transactions on Magnetics | 0 | 0 | |
2015 | Spin injection induced phase transition in YBa<inf>2</inf>Cu<inf>3</inf>O<inf>7-δ</inf>/Nd<inf>0.35</inf>Sr<inf>0.65</inf>MnO<inf>3</inf> bilayer | Cheng, S.L.; Lin, J.G.; SOO-FIN CHENG ; TUNG-HAN CHUANG ; Lin, J. G. | Journal of Applied Physics | 0 | 0 | |
2021 | Sputtering of Ag (111) nanotwinned films on Si (100) wafers for backside metallization of power devices | Wu P.-C; Lai Y.-C; Lee P.-I; Chiang M.-T; Chou J; Chuang T.-H.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | | | |
2011 | Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder | Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.; ChuangTH | Journal of Materials Science Materials in Electronics | 64 | 53 | |
1997 | Stress corrosion cracking of superplastically formed 7475 aluminum alloy | Tsai, T.C.; Chang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
1999 | Stress-corrosion cracking susceptibility of the superplastically formed 5083 aluminum alloy in 3.5 pct NaCl solution | Chang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |