Soldering reactions between In49Sn and Ag thick films

Journal

Journal of Electronic Materials

Journal Volume

31

Journal Issue

3

Pages

171-177

Date Issued

2002

Author(s)

Cheng, M.D.

Wang, S.S.

Chuang, T.H.

TUNG-HAN CHUANG

DOI

10.1007/s11664-002-0202-8

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492035

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036503099&doi=10.1007%2fs11664-002-0202-8&partnerID=40&md5=cec93b7126a44bb35a40d2b3549b55d4

Type

journal article