公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2004 | Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes | Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han | Journal of Electronic Materials | 6 | | |
2008 | Size effect of rare-earth intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce solders on the growth of tin whiskers | Chuang, T.H.; Lin, H.J.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2002 | Soldering reactions between In49Sn and Ag thick films | Cheng, M.D.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2014 | Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer | Chuang, T.H.; Lin, H.J.; Chuang, C.H.; Yeh, W.T.; Hwang, J.D.; Chu, H.S.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2016 | Solid Liquid Interdiffusion Bonding of Zn<inf>4</inf>Sb<inf>3</inf> Thermoelectric Material with Cu Electrode | Lin, Y.C.; Lee, K.T.; Hwang, J.D.; Chu, H.S.; Hsu, C.C.; Chen, S.C.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2017 | Spin Diffusion Length in Ferromagnet/Superconductor Bilayers | Cheng, S. L.; Chuang, T. H.; TUNG-HAN CHUANG | IEEE Transactions on Magnetics | 0 | 0 | |
2015 | Spin injection induced phase transition in YBa<inf>2</inf>Cu<inf>3</inf>O<inf>7-δ</inf>/Nd<inf>0.35</inf>Sr<inf>0.65</inf>MnO<inf>3</inf> bilayer | Cheng, S.L.; Lin, J.G.; SOO-FIN CHENG ; TUNG-HAN CHUANG ; Lin, J. G. | Journal of Applied Physics | 0 | 0 | |
2021 | Sputtering of Ag (111) nanotwinned films on Si (100) wafers for backside metallization of power devices | Wu P.-C; Lai Y.-C; Lee P.-I; Chiang M.-T; Chou J; Chuang T.-H.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | | | |
2011 | Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder | Chuang, T.H.; Wu, M.W.; Chang, S.Y.; Ping, S.F.; Tsao, L.C.; ChuangTH | Journal of Materials Science Materials in Electronics | 64 | 53 | |
1997 | Stress corrosion cracking of superplastically formed 7475 aluminum alloy | Tsai, T.C.; Chang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
1999 | Stress-corrosion cracking susceptibility of the superplastically formed 5083 aluminum alloy in 3.5 pct NaCl solution | Chang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2021 | The structures and thermoelectric properties of Zn-Sb alloy films fabricated by electron beam evaporation through an ion beam assisted deposition | Hsu S.-C; Hong J.-Y; Chen C.-L; Chen S.-C; Zhen J.-H; Hsieh W.-P; Chen Y.-Y; Chuang T.-H.; TUNG-HAN CHUANG | Applied Surface Science | | | |
2020 | Study on thermoelectric property optimization of mixed-phase bismuth telluride thin films deposited by co-evaporation process | Wu, Y.-J.; Hsu, S.-C.; Lin, Y.-C.; Xu, Y.; Chuang, T.-H.; Chen, S.-C.; TUNG-HAN CHUANG | Surface and Coatings Technology | | | |
1996 | Superplastic forming by decomposition of (CaCO<inf>3</inf> + C) and MgCO<inf>3</inf> | Shyu, J.S.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
1999 | Surface morphologies and erosion rates of metallic building materials after sandblasting | Fang, C.-K.; Chuang, T.H.; TUNG-HAN CHUANG | Wear | | | |
2013 | Surface reconstruction of an annealing twinned Ag-8Au-3Pd alloy wire under current stressing | Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lin, H.-J.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
1999 | Synergistic effects of wear and corrosion for Al2O3 particulate-reinforced 6061 aluminum matrix composites | Fang, C. K.; Huang, C. C.; Chuang, T. H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science | | | |
1996 | Technical Note: Relationship between Electrical Conductivity and Stress Corrosion Cracking Susceptibility of Al 7075 and Al 7475 Alloys | Tsai, T.C.; Chuang, T.H.; TUNG-HAN CHUANG | Corrosion (Houston) | | | |
2007 | Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints | Chuang, Tung-Han | Metallurgical and Materials Transactions A | 24 | | |
2014 | Thermal stability of grain structure and material properties in an annealing twinned Ag-4Pd alloy wire | Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Shiue, Y.-Y.; Shieu, F.-S.; Huang, Y.-L.; Hsu, P.-C.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |