Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
2021 | Eye Comparison between Unencoded and 128b/130b-encoded NRZ Signals | Weng P.-Y; Chen C.-H; Chen J; Kuo E; Lin E; Chu P; Liao C.-L; Mutnury B; TZONG-LIN WU | EPEPS 2021 - IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems | 0 | 0 | |
2018 | An eye diagram improvement method using simulation annealing algorithm | P. J. Li; T. L. Wu; TZONG-LIN WU | IEEE 22nd Workshop on Signal and Power Integrity (SPI) | 2 | 0 | |
2012 | Eye prediction of digital driver with power distribution network noise | C.-C. Chou; H.-H. Chuang; S.-H. Weng; C.-K. Cheng; TZONG-LIN WU | IEEE Elect. Performance Electronics Package Systems | | | |
1997 | Fabrication and electromagnetic modeling of fiber-optic coupling devices based on weakly fused tapered structure | H.-C. Chang; C.-W. Wu; T.-L. Wu; S.-W. Yang; G.-J. Liao; TZONG-LIN WU | Taiwan Optoelectron. Ind. Technol. Develop. Conf. | | | |
2018 | Factors affecting near-end crosstalk (NEXT) in high speed serial links | Weng, P.-Y.; Chen, C.-H.; Chen, C.-H.; Liao, C.-L.; Wu, T.-L.; Mutnury, B.; TZONG-LIN WU | 15th International Conference on Electromagnetic Interference and Compatibility, INCEMIC 2018 | | | |
2018 | Fast and accurate yield rate prediction of PCB embedded common-mode filter with artificial neural network | Y. T. Lin; C. H. Cheng; T. L. Wu; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) | 5 | 0 | |
2014 | Fast prediction of radiation from high-speed/high-density connectors | H.-C. Chen; T.-L. Wu; S. Connor; B. Archambeault; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | | | |
0 | Filtering device and differential signal transmission circuit capable of suppressing common-mode noises upon transmission of a differential signal | TZONG-LIN WU ; Chung-Hao Tsai | | | | |
1995 | Form birefringence of biconical-taper fiber-optic couplers under weakly fused condition | TZONG-LIN WU ; H.-C. Chang | Topical Meeting Integr. Photon. Research | | | |
2020 | A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network | Chen, S.; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2008 | Fundamentals of signal integrity | TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | | | |
2018 | HBM3 PPA Performance Evaluation by TSV Model with Micro-Bump and Hybrid Bonding | Huang, Li Hsin; Cheng, Yu Ying; TZONG-LIN WU | EPEPS 2023 - IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems | | | |
2005 | High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure | H.-C. Kuo; S.-T. Chen; C.-C. Wang; S.-W. Wen; H.-C. Li; C.-C. Chien; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | | | |
2005 | High electromagnetic shielding of plastic package for 2.5Gbps optical transceiver modules | TZONG-LIN WU ; C.-W. Lin; W.-C. Hung; C.-H. Lee; W.-S. Jou; W.-H. Cheng | IEEE Transactions on Advanced Packaging | | | |
2005 | High electromagnetic susceptibility (EMS) plastic package for 10Gbps optical transceiver module | TZONG-LIN WU ; M.-C. Lin; C.-H. Lee; T.-T. Shih; W.-H. Cheng | Electronics Letters(SCI) | | | |
2019 | A High-Performance Common-Mode Noise Absorption Circuit Based on Phase Modification Technique | Chan, C.-K.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | | | |
2009 | Impact of Photonic Crystal Power/Ground Layer density on power integrity performance of high-speed power buses | Scogna, A.C.; Orlandi, A.; Ricchiuti, V.; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | | | |
2020 | An Improved Method of Finding Complex Permittivity of Lossy Liquids | Liu R.-J; Chou C.-C; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | 0 | 0 | |
2019 | Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems | Weng, P.-Y.; Cheng, C.-H.; Wu, T.-L.; Chen, C.; Chen, J.; Kuo, E.; Liao, C.-L.; Mutnury, B.; TZONG-LIN WU | 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019 | | | |
2006 | Improving the radiated immunity of the strip-lines using a novel hybrid EBG structure | H.-C. Kuo; S.-T. Chen; TZONG-LIN WU | IEEE Elect. Performance Electron. Package. Systems | | | |