Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
2021 | Flexible Complementary Oxide Thin-Film Transistor-Based Inverter with High Gain | Hsu S.-M; Su D.-Y; Tsai F.-Y; Chen J.-Z; FENG-YU TSAI ; JIAN-ZHANG CHEN ; I-CHUN CHENG | IEEE Transactions on Electron Devices | 14 | 15 | |
2016 | Flexible Complementary Oxide-Semiconductor-Based Circuits Employing n-Channel ZnO and p-Channel SnO Thin-Film Transistors | Li, Y.-S.; He, J.-C.; Hsu, S.-M.; Lee, C.-C.; Su, D.-Y.; Tsai, F.-Y.; I-CHUN CHENG ; FENG-YU TSAI | IEEE Electron Device Letters | 58 | 56 | |
2009 | FLEXIBLE ELECTRONICS: MATERIALS AND APPLICATIONS(CH1) | Cheng, I-Chun ; Wagner, S. | | | | |
2009 | FLEXIBLE ELECTRONICS: MATERIALS AND APPLICATIONS(CH3) | Gleskova, Helena; Cheng, I-Chun ; Wagner, Sigurd; Suo, Zhigang | | | | |
2005 | Flexible Flat Panel Displays | Wagner, Sigurd; Gleskova, Helena; Cheng, I-Chun ; Sturm, James C.; Suo, Z. | | | | |
2020 | Flexible reduced graphene oxide supercapacitors processed using atmospheric-pressure plasma jet under various temperatures adjusted by flow rate and jet-substrate distance | Fan, C.-F.; Chien, Y.-C.; Hsu, C.-C.; Cheng, I.-C.; Chien, L.-H.; JERRY CHENG-CHE HSU ; JIAN-ZHANG CHEN ; I-CHUN CHENG | Materials Research Express | 5 | 4 | |
2006 | Flexible stainless steel substrates for a-Si display backplanes | Wagner, S.; Cheng, I.-C.; Kattamis, A.Z.; Cannella, V.; Hong, Y.; I-CHUN CHENG | SID Conference Record of the International Display Research Conference | | | |
2005 | Flexible stainless-steel substrates | Cannella, V.; Izu, M.; Jones, S.; Wagner, S.; Cheng, I.-C.; I-CHUN CHENG | Information Display | | | |
2005 | Flexible stainless-steel substrates – Is steel real | V. Cannella; M. Izu; S. Jones; S. Wagner; I-C. Cheng; I-CHUN CHENG | SID Information Display | | | |
2014 | Flexible substrate with low reflection, low haze, self-cleaning, and high hardness by nano-structured hard coating and surface treatment | Lan, Y.-H.; Yang, T.-Y.; Liu, Y.-H.; Lin, D.-H.; Wang, B.-H.; Wei, M.-K.; Chiu, T.-L.; Lin, C.-F.; Peng, L.-H.; Cheng, I.-C.; Li, I.-Y.; Wei, C.-K.; I-CHUN CHENGet al. ; JIUN-HAW LEE ; LUNG-HAN PENG | Digest of Technical Papers - SID International Symposium | 2 | 0 | |
2014 | Flexible TFT Circuit Analyzer Considering Process Variation, Aging, and Bending Effects | E. H. Ma; W. E. Wei; H. Y. Li; J. C. M. Li; I. C. Cheng; Y. H. Yeh; I-CHUN CHENG ; CHIEN-MO LI | IEEE Journal of Display Technology | 3 | 3 | |
2013 | Flexible transparent ZnO:Al/ZnO/CuAlOx:Ca heterojunction diodes on polyethylene terephthalate substrates | Chi C.-T.; Lu I.-F.; Chiu I.-C.; Chen P.-Y.; Huang B.-W.; I-CHUN CHENG ; JIAN-ZHANG CHEN | Journal of Electronic Materials | 15 | 15 | |
2018 | Flexible vertically-stacked complementary inverters composed of oxide thin-film transistors | S.-M. Hsu; W.-C. Lin; D.-Y. Su; F.-Y. Tsai; I-C. Cheng; I-CHUN CHENG | International Electron Devices & Materials Symposium (IEDMS 2018) | | | |
2010 | Formation of single-electron-transistors using self-assembly of nanoparticle chains | Tsai, L.-C.; Cheng, I.-C.; Tu, M.-C.; Chen, C.-D.; Lin, H.-Y.; I-CHUN CHENG | Journal of Nanoparticle Research | | | |
2008 | Fracture mechanisms of sink thin-films on compliant substrates | Kattamis, A.Z.; Cherenack, K.H.; Cheng, I.C.; Long, K.; Sturm, J.C.; Wagner, S.; I-CHUN CHENG | Materials Research Society Symposium | | | |
2014 | Gate-bias stress stability of P-type SnO thin-film transistors fabricated by RF-sputtering | Chiu, I.-C.; Cheng, I.-C.; I-CHUN CHENG | IEEE Electron Device Letters | 63 | 63 | |
2022 | Helium Dielectric Barrier Discharge Plasma Jet (DBD Jet)-Processed Graphite Foil as Current Collector for Paper-Based Fluidic Aluminum-Air Batteries | Shih, CY; Ni, IC; Chan, CL; JERRY CHENG-CHE HSU ; Wu, CI; I-CHUN CHENG ; JIAN-ZHANG CHEN | ENERGIES | 1 | 1 | |
2015 | HfZnO/ZnO heterostructures fabricated using low-cost large-area compatible sputtering processes | Li, C.-H.; Chen, J.-Z.; I-CHUN CHENG ; JIAN-ZHANG CHEN | Materials Research Society Symposium | 0 | 0 | |
2001 | High electron mobility TFTs of nanocrystalline silicon deposited at 150°C on plastic foil | Cheng, I.-C.; Wagner, S.; Bae, S.; Fonash, S.J.; I-CHUN CHENG | Materials Research Society Symposium | | | |
2003 | High hole and electron field effect mobilities in nanocrystalline silicon deposited at 150 °C | Cheng, I.-C.; Wagner, S.; I-CHUN CHENG | Thin Solid Films | 26 | 22 | |