Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2000 | Market Structure and Performance in Taiwan Banking Industry | 鄭秀玲 ; C. Peng | Advances in Pacific Basin Business , Economics and Finance | |||
2018 | Novel RDL design of wafer-level packaging for signal/power integrity in LPDDR4 application | K.-B. Wu; T.-Y. Kuo; B. Hung; B. Lin; C. Peng; M.-T. Yang; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 10 | 6 |